Solder feed unit Hakko FU-500

Description Hakko FU-500

FU-500 / FU-601 can be combined with various robots and other actuators to build an automatic soldering process at low cost.

*LCIA: Abbreviation for Low Cost Intelligent Automation
*The robot part is not included in this product.

Đặc điểm nổi bật Hakko FU-500

Accurate solder feeding

FU-500 features a compact drive unit that allows the solder feed unit to be brought closer to the iron. This adaptation makes it possible to increase the repeat accuracy of amount of solder feeding.

Equipped with countermeasures against solder ball scattering as standard

As countermeasure against scatter of flux and solder balls, the unit is equipped with a mechanism that perforates into the solder wire as standard. It is also possible to change acceptable solder wire diameter by simply replacing the pulley unit.

Supports solder diameters of 0.3 mm and up

As the unit is capable of handling extremely small solder diameter of 0.3 mm, it can be used for delicate soldering jobs.

Supported solder diameter 0.3 mm to 1.6 mm.

High-performance programming

100 programs each configurable for "Point soldering" and "Drag soldering" at low price.
Programs can be edited by PC via a USB connection.

Easy adjustment of solder feeding position

Adjustment of the position of solder feeding to the tip is critical for auto-soldering systems. FU-500 lets you adjust the solder feeding position just by turning an adjustment screw with a wrench.

Solder feed error detection

With an optical sensor for solder movement, FU-500 can detect solder clogging, slipping and the end of the roll.